Through its wholly owned subsidiary, DCI, Inc., The company provides a range of design, manufacturing, integration, and testing services to OEMs.
Its engineering staff provides hardware design, software design, and component engineering services under contract to OEMs.
Its manufacturing processes produce assemblies incorporating both conventional electronic packaging and high-density configurations, including ball grid array and microelectronic technologies.
Elecsys also maintains manufacturing capabilities that include automated surface mount technology component placement, automated solder paste application and soldering, automated through-hole component insertion, wire bonded chip on board microelectronic assembly, and complete in-circuit, and functional testing services.
The company integrates its customers' electronic assemblies with various specialized interface technologies, such as custom liquid crystal displays (LCDs) and light emitting diode (LED) display arrays; custom keypads; and other user input devices, as well as application specific backlights, and illumination sources.
In addition, Its LCD fabrication process produces custom LCDs for various applications.
The company was formerly known as Airport Systems International, Inc.
and changed its name to Elecsys Corporation in November 2000.
Elecsys was incorporated in 1991 and is headquartered in Lenexa, Kansas.
